Fabrication
PCB Fabrication
Material and Laminates
- FR-4 Multi-Functional (140C)
- FR-4 High Temp (180C)
- FR407/FR408
- Nelco 4000 Series
- IS410 and 370HR
- Polyimide
- GETEK
- Rogers 4000 Series
- 370HR Series
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Board Geometry
- Min board size: 1″ x 1″
- Max board size: 30″ x 30″
- Min board thickness: 0.005″/0.127mm
- Max board thickness: 0.250″/6.35mm
- Thickness tolerance: +/- 5mils
- Cu weight: 0.25 Oz – 6 Oz
- Bow and Twist: 0.5%
- Maximum Layers: 60
Line and Spacing
- Trace width min (inner): 3-2 mils (Cu weight dependent)
- Trace width min (outer): 4-2 mils (Cu weight dependent)
- Min space (inner/outer layer): 3/3 mils
- Tolerance: +/- 20%
- Fine-line width and trace spacing: 2/2 mils (using laser and/or plasma etching)
Drill and Aspect Ratio
- Minimum drilled hole size: 0.2mm/7.87mils
- Maximum drilled hole size: 6.5m/256mils
- NPTH hole tolerance: +/- 2mils
- Min finished hole size (PTH – 062): 0.1mm/3.94mils
- Min finished hole size (PTH – 120): 0.35mm/13.78mils
- PTH hole tolerance: +/- 2mils
- Drill hole gap to trace/pad: 4mils
- 25:1 Aspect Ratio
- Depth controlled, blind via, buried via, pad over via, filled via
Plating/Surface Finish
- Copper Plating: up to 400 µinches
- Tin-Nickel Plating
- Electroless Nickel: 120 to 200 µinches thickness
- Electrolytic Nickel: 350 µinches thickness
- ENIG: 2 to 6 µinches thickness
- Full body gold (Hard Gold): up to 100 µinches
- Selective Gold: up to 100 µinches
- Soft Bondable Gold
- Hot Air Solder Level (HASL)
Soldermask and Silkscreen
- Soldermask clearance pad : 2 mils
- Clearance Pad to Trace edge : 3 mils
- Minimum solder dam: 3 mils
- Soldermask thickness: 0.4mils
- We use Liquid Photo-Imageable with spray systems
- Soldermask over bare copper (SMOBC)
Impedance Control
- Impedance controlled trace: 50 ohms/75 ohms/others
- (Applicable for differential or single trace)
- Tolerance > 50 Ohms: +/- 10 Ohms
- Tolerance < 50 Ohms: +/- 5 Ohms
Electrical Testing
- Flying Probe & Grid Test Fixtureless
- Double side test 10-100 volt
- Continuity resistance 10-30 Ohms
- Isolation resistance 2.5-10.0 MegOhms
- Full Net List Test
- Polar/TDR for impedance testing
- We provide PCB cross section if requested!
Loadboards Boards ATE/DUT
Features
- Teradyne: uFlex, Catalyst, A565, J750
- Credence: ASL1K,3K, VISTA, DUO, QUARTET, SC212, SC312
- Eagle: ETS-364
- Nextest: PT1 & 2, Lightning, VT, GT, Magnum
- Hewlett Packard/Agilent: Verigy, 93K
- LTX, Sentry, MCT
- FPC; RIGID FLEX
Burn-In Boards
Features
- We have a complete design solutions from design to manufacturing High Density, Fine Pitch, High Power and Impedance Control BIBs
- MIL STD-883E maintained for military devices
- Standard BIB size: 12″ x 24″
- Large BIB format: 22.5″ x 26″
- Can do 3mils line/space and 6mils micro-drill
- Via-in-pad for fine pitch BGA sockets
- Down to 0.4mm pitch
- Mixed dielectrics for cost/performance optimization
- Manufacturing and assembly time of 3-4 weeks for BIBs
- 12 layers in 1.6mm and 24 layers for MCC
Pogo Pins
Features
- Highest Quality Product
- Best Test Yield
- Competitive Price
- Intensive Local Support
- One Stop Total Solution
- No NRE Charge
- No Tooling Charge
- Intelligent Design Engineering
- Precision Manufacturing
Services
PCB Design
PCB Design Capabilities
- Analog, Digital, Mixed Signal, RF Applications
- High Speed/Impedance Controlled boards
- Equal trace lengths & Differential pairs
- High current/heavy Cu board
- EMI/EMC compliance board
- Use of microvia, pad over via, blind via, buried via
- High density interconnect (HDI) technology
- Complies to IPC design standards
- Complete assembly drawings if needed
- Professional fabrication documents
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Design Requirements
- Bill of Materials/BOM List
- Schematic Diagram
- Package Outline Drawing (for loadboard, DUT, BIB)
- Board Outline/Template (for loadboard, DUT, BIB)
- Mechanical Drawings e.g. Socket, stiffener, case enclosure, etc
- Special instructions on placement and routing, critical traces, impedance or differential pairs
- Special instructions on layer stack up/hybrid laminates
Fabrication Requirements
- Gerber File (R274X)
- NC Drill
- Fabrication Notes
- Special Instructions if needed
Supported Platforms
- Teradyne: uFlex, Catalyst, A565, J750
- Credence: ASL1K,3K, VISTA, DUO, QUARTET, SC212, SC312
- Eagle: ETS-364
- Nextest: PT1 & 2, Lightning, VT, GT, Magnum
- Hewlett Packard/Agilent: Verigy, 93K
- LTX, Sentry, MCT
- FPC; RIGID FLEX
PCB Reverse Engineering
FSA can do reverse engineering of obsolete OEM circuit boards, missing manufacturing data and the like. We use state-of-the-art LASER SCAN on single, dual and multi-layer boards. Output can be a Gerber file or in DXF format. Because of laser technology, we guarantee 100% board reproducibility anytime, all the time.
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Schematic Capture
- Cadence Allegro/Orcad
- Mentor Graphics
- Zuken Cadstar
Layout
- Cadence Allegro/Orcad
- Mentor Graphics
- Zuken Cadstar
- 3x/4x trace width spacing where possible
- No additional vias for the controlled impedance signals
Layer Stacking
- Top and bottom ground reference for controlled impedance layer.
- Dedicated layer for controlled impedance signals and power signals.
PCB Replating and Rework
Process of re-coating abraded DUT pads, component terminals, pogo traces and edge fingers to convey the original functionality of the devices contact points.
Plating of probe pins contact will extend the life span of the probe pins. It will also eliminate poor contact in between wafer pads and probe pins via Hole rework, Component Repair, Removal, Replacement, Inner Trace Repair, or Pell-off Pad Rework.
Note: Plating is also applicable on probe pins (both vertical and cantilever, pogo pins, socket pins, component terminals and jewelries.
Burn-In Solutions
Inspire 8160HX High Power
- Individual DUT Temperature Control
- Up to 480W per BIB
- 6 power supplies per BIB
- full software controlled & monitored
- Localized power deliver for most accurate, low-noise DC voltage
- 144 drive channels
- 25MHz data rate, 16MB vector depth
- up to 48 monitor channels
- Up to 24 slots per system
- Legacy BIB form factor (12.32″x23.85″x0.062″)
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Elevated Voltage Levels for Medical Devices
- HV System: up to 800V/20mA
- LV System: up to 12V/1A
- Up to ±24V Analog DUT Power
- Software PS control and monitoring
8 or 16 Drive Channels
- VOH: 0V to +10V
- VOL: -3.3V to 0V
- 25 MHz, 16M vector depth
80 or 96 Monitor Channels
- Frequency
- Sign of Life
- Voltage
- Vector Compare
Legacy Burn-in System Retrofit
- Oven Electrical and Mechanical Design for Retrofitting various system platforms like:
-
- Incal
- Rel-Inc Criteria
- Aehr Test / Adec
- MCC HPBx / Abes
- Other various HTOL, HAST, and THB Systems
Customize Burn-In Ovens
Custom-configured systems for various applications
- HTOL / HTRB
- THB / HAST
- High Voltage / Cap Discharge Systems
- Individual DUT Temp Control
- Digital and Analog Signals
- Engineering or Production
Driver & Power Supply Technology
- Configurable VOH / VIL / Freq / PS control
- Positive and Negative Supplies
- Pattern Conversion & Debug Tools
- Test During Burn-in Capabilities
Software Technology
- Full system control incl. chamber temp
- Burn-in Lot Monitoring
- Pinpoint Failure to DUT / Signal level
Equipment Sourcing
- Refurbished equipment
- 2nd hand
- Front line, back-end equipment
- Industrial Ovens
Assembly
Board Stuffing for Prototype & Mid Volume
Features
- MRP-driven Procurement & Mfg process
- SMT and Thru-Hole Assembly
- Top and Bottom-side SMT
- Mechanical Assembly
- Rails, Connectors, Heatsinks
- Automated and Hand-Assembly
- In-process Quality Checks
- Final electrical test on TSE BOSS Tester (customer-supplied probes)